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Toshiba to Expand Power Semiconductor Production Capacity with 300 Millimeter Wafer Fab | News

KAWASAKI, Japan–(BUSINESS WIRE)–February 3, 2022–

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced the construction of a new 300 millimeter wafer fab for power semiconductors at its main discrete semiconductor production base, Kaga Toshiba Electronics Corporation, in Ishikawa Prefecture. Construction will take place in two phases, optimizing the pace of investment in relation to market trends, with Phase 1 production expected to start in FY24. When Phase 1 reaches full capacity , Toshiba’s power semiconductor production capacity will be 2.5 times that of fiscal 2021 [1].

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Toshiba: Artist’s impression of the new 300 millimeter wafer manufacturing plant, Kaga Toshiba Electronics (the building on the right). (Graphic: Business Wire)

Power devices are essential components to manage and reduce the energy consumption of all types of electronic equipment and to achieve a carbon neutral society. Current demand is growing on vehicle electrification and industrial equipment automation, with very high demand for low voltage MOSFETs (metal oxide semiconductor field effect transistors) and IGBTs (insulated gate bipolar transistors) and other devices. To date, Toshiba has responded to this growth in demand by increasing production capacity on 200 millimeter lines and accelerating the start of production on 300 millimeter production lines from the first half of the fiscal year. 2023. [2] until the second half of fiscal 2022. Decisions on overall new fab capacity and equipment investment, production start-up, production capacity and production plan will reflect market trends.

The new plant will have an earthquake-absorbing structure; improved BCP systems, including dual feed lines; and the latest energy efficient manufacturing equipment to reduce environmental loads. It will also aim to achieve the “RE100” objective of 100% use of renewable energies. Product quality and production efficiency will be improved through the introduction of artificial intelligence and automated wafer transport systems.

Going forward, Toshiba will expand its power semiconductor business and strengthen its competitiveness through timely investment and research and development that will enable it to meet rapidly growing demand and contribute to a low-income society. energy consumption and carbon neutrality.


[1] The total wafer manufacturing capacity of 200 and 300 millimeters (equivalent to 200 millimeters)

[2] Toshiba Electronic Devices & Storage Corporation Announces Major Investment in Power Devices Business

– Ready to start construction of 300 millimeter wafer fabrication facility – (March 10, 2021)


Schedule (Schedule)

Start of work: spring 2023

Construction completed: spring 2024

Start of production: as part of fiscal year 2024

Introducing Kaga Toshiba Electronics Corporation

Location: 1-1, Iwauchi-cho, Nomi-shi, Ishikawa Prefecture, Japan

Created: December 1984

President and Representative Director: Hideo Tokunaga

Employees: approx. 1,000 (as of September 30, 2021)

Main products: discrete semiconductors (power semiconductors, small-signal devices and optoelectronic devices)

* Company names, product names and service names may be trademarks of their respective companies.

* Information contained herein, including product pricing and specifications, service content, and contact information, is current as of the date of announcement but is subject to change without notice.

About Toshiba Electronic Devices & Storage Corporation

Toshiba Electronic Devices & Storage Corporation, a leading provider of advanced semiconductor and storage solutions, draws on more than half a century of experience and innovation to offer its customers and business partners outstanding discrete semiconductors, system LSIs and HDD products.

The company’s 22,000 employees worldwide share a common commitment to maximizing product value and promoting close collaboration with customers in the co-creation of value and new markets. With annual sales now exceeding 710 billion yen (6.5 billion US dollars), Toshiba Electronic Devices & Storage Corporation looks forward to building and contributing to a better future for people around the world.

Learn more at https://toshiba.semicon-storage.com/ap-en/top.html

See the source version on businesswire.com: https://www.businesswire.com/news/home/20220203005432/en/

CONTACT: Media Inquiries:

K.Tanaka, E.Sugizaki

Corporate Communications and Market Intelligence Group

Business Planning Division.

Toshiba Electronic Devices & Storage Corporation

Tel: +81-44-548-2122

Email: [email protected]



SOURCE: Toshiba Electronic Devices & Storage Corporation

Copyright BusinessWire 2022.

PUB: 02/03/2022 8:00 p.m. / DISC: 02/03/2022 8:02 p.m.


Copyright BusinessWire 2022.